New integrated chip package with a thermally conductive polymer field Advances

Recently, School of Materials Science and Engineering, East China University of Technology Professor Wu Wei issue group by metal and ceramic particle design, synthesis and assembly, the successful preparation of the new hybrid thermally conductive filler. Such thermally conductive filler ability to build a network of polymer obtained in significantly improved heat transfer performance can be significantly improved polymeric material, having a significant value . The research work \”Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles\” in the title, published online in the internationally renowned journal Materials & Design on. With the advent of the era of 5G, all things Internet has become a trend in which highly integrated microchip is an important foundation to achieve this change. However, the thermal conductivity of the polymeric material for the chip package is poor, severely restricts the development of integrated chip. As the chip size decreases, the energy density of the exponentially increased, the generated heat accumulates in the interior, so that the heat dissipation becomes a major problem. Preparation of thermally conductive filler having a specific structure polymer is an effective method for the filling of its thermal conductivity is improved by design. Professor Wu Wei TF by in situ reduction of Cu2 + to achieve a two-dimensional load boron nitride (BN) sheets of zero dimension Cu balls prepared new BN @ Cu hybrid filler. Because of the special structural features such BN filler Cu @ hybrid, on the one hand to improve the surface roughness of the filler, the filler surface due to the two-dimensional projection BN zero dimension Cu balls easier to form thermally stable network; on the other hand increased between the filler and matrix the contact area, the heat from the polymer matrix in the form of phonons and then passed through a two-dimensional BN provided by the action of Cu nanoparticles internet conductive ball more smooth channel, reducing phonon scattering. Result of the interaction therebetween, effectively improves the thermal conductivity of the polymer. Through the study of different filler loadings hybrid thermal conductivity of the polymer obtained most effective thermally conductive filler network structure constructed, improved thermal conductivity of the polymer is 500%. Such novel hybrid thermallyFiller with respect to a single thermally conductive filler, not only reflected in the ability to build a network of thermal conductivity of the obvious advantages, but also significantly reduce contact resistance, has important scientific significance and value of the research to improve the thermal conductivity of the polymer. 集成化芯片封装用导热聚合物领域研究新进展 Dr. Graduate School of Materials Science and Engineering Wang Yi is the first author of the outcome, Professor Wu Wei and Germany Erlangen – Nuremberg University Professor Dietmar Drummer is co-corresponding author. The research was supported by the National Natural Science Foundation of China (NSFC) and the German Research Association (DFG) joint fund \”Sino-German research team,\” CSC innovative international talent training cooperation project \”Sino-German cooperation in new functional polymer materials high-end R & D personnel of international joint training \”and other projects funded. Original link: https: //