Sun Rong team series of high-performance thermally conductive composite material progress in research

Recently, the Shenzhen Institute of Advanced Technology, Chinese Academy of integration of the Advanced Materials Center researcher Sun Rong team made a series of progress in the study of high-performance thermally conductive composite material. Modern electronic devices gradually to highly integrated and high-power development, if the heat generated inside the device can not be effectively distributed, will cause thermal failure. In order to ensure the performance and life of electrical devices, effective heat dissipation has become a major factor restricting the development of electronic products. Solve the heat problem depends on the development of thermal management materials. A thermally conductive filler and a thermally conductive material is generally a polymeric matrix, conventional blend solution was prepared composite material containing a random distribution of the filler. However, due to the lack of an effective interconnection between the interior of the filler, to improve the thermal conductivity of this composite material is generally very low. Lack filler passage means phonon thermal conductivity of more heat will occur at the interface of the filler / matrix, the greater the interfacial thermal resistance. On the other hand, addition of large amounts of filler (> 60 wt% / vol%) will be obtained although the thermal conductivity is preferable, but it will seriously affect the mechanical properties and processability of the composite, it is difficult practical. Thus, for the heat conducting composite material, how at a lower filler content to achieve high thermal conductivity is still a big challenge. Panel according to what people team thermally conductive, has a small light and the like through the structural design of the filler orientation, aspect ratio and combination of high thermal conductivity of silicon carbide nanowires were prepared by the template method Macroorientation ice carbide line network, and as a high thermal conductivity composite filler prepared. For phonons, the most convenient way through the polymer is established in the interior of the channel filler polymer. Thus, a linear filler comprising high thermal conductivity polymer composite will show great increase the thermal performance. Improve the efficiency of thermal conductivity of the composite material is 3 to 8 times the thermal insulation efficiency of the composite material of other reports, an internal filler having a three-dimensional interconnected network of highly heat conductive composite material has a great application potential in the field of thermal management. Related Articles Vertically Aligned and Interconnected SiC Nanowire Networks Leading to Significantly Enhanced Thermal Conductivity of Polymer Composites ( \”composite material having a high thermal conductivity of silicon carbide outer surface of the alignment line network\”) published in the journal AC lineS Applied Materials & Interfaces (DOI: 10.1021 / acsami.8b00328).

孙蓉团队在高性能导热复合材料研究系列进展
D SiC thermally Schematic line network

The boron Panel D – Construction of the thermally conductive graphene network Progress has also been made. Early researchers in order to make a three-dimensional skeleton fillers have certain mechanical strength, during the preparation of the three-dimensional framework is normally added to the binder. However, phonon spectrum between the binder and the filler does not weaken the heat transfer packing will match the backbone itself, and thus comprise a three-dimensional skeleton filler thermal conductivity of polymer matrix composites are often not ideal. The project team with the phonon transport properties of boron nitride and similar graphene assembly unit constructed oriented network phonon thermal conductivity. The outer surface of the thermal conductivity of the composite material reached 5.05 Wm-1K-1, the value higher than the thermal conductivity of boron nitride-based composite material of the other reports. Related Articles Construction of Three-dimensional Skeleton for Polymer Composites Achieving a High Thermal Conductivity ( \”To construct a three-dimensional network of high-performance composite thermally conductive material\”) published online journal Small (DOI: 10.1002 / smll.201704044).

孙蓉团队在高性能导热复合材料研究系列进展
three boron helium – thermally conductive graphene Schematic network

The group also proposed a novel method of molding material. Limited by factors such as cost and production equipment, vacuum-assisted filtration technique and ice templating self-assembly technology is difficult to achieve industrialization, unable to contribute to China\’s electronic materials industry. Accordingly, a small light TF was explored and developed a simple, rapid and macro-prepared method thermally conductive filler. By filler-containing aqueous dispersion liquid is directly added dropwise to liquid nitrogen, freeze-dried and the simple binding of a self-propelled apparatus, can successfully build a three-dimensional spherical filler airgel. Such a spherical filler having a large specific surface area and porosity, thermal conductivity directly involved in constructing the network which can effectively increase the thermal properties of composite materials, with the aid of a self-propelled apparatus can achieve a small laboratory scale batch. In addition, this specialMicrostructure and adsorption in the energy sector also showed great potential. Related papers Liquid nitrogen driven assembly of nanomaterials into spongy millispheres for various applications ( \”multi-functional three-dimensional liquid nitrogen preparation of airgel drive the ball\”), published online in the journal Journal of Materials Chemistry A (DOI: 10.1039 / C8TA00310F).

孙蓉团队在高性能导热复合材料研究系列进展
principle prepare a three-dimensional diagram of airgel balls

more research was focused on Science and Technology R & D projects (2017YFB0406000), (2011D052), Key Laboratory of Guangdong Province, Guangdong Province, innovation research team funding (2014B030301014) and the Shenzhen Municipal Science and Technology and other projects.

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